BCR 166T E6327

BCR166... PNP Silicon Digital Transistor • Switching circuit, inverter, interface circuit, driver circuit • Built in bias resistor (R1 = 4.7 kΩ , R2 = 47 kΩ ) BCR166/F/L3 BCR166T/W C 3 R1 R2 1 B 2 E EHA07183 Type Marking Pin Configuration BCR166 WTs 1=B 2=E 3=C - - - SOT23 BCR166F WTs 1=B 2=E 3=C - - - TSFP-3 BCR166L3 WT 1=B 2=E 3=C - - - TSLP-3-4 BCR166T WT 1=B 2=E 3=C - - - SC75 BCR166W WTs 1=B 2=E 3=C - - - SOT323 1 Package 2006-05-03 BCR166... Maximum Ratings Parameter Symbol Value Collector-emitter voltage VCEO 50 Collector-base voltage VCBO 50 Input forward voltage Vi(fwd) 30 Input reverse voltage Vi(rev) 5 Collector current IC Total power dissipation- Ptot 100 200 BCR166F, TS ≤ 128°C 250 BCR166L3, TS ≤ 135°C 250 BCR166T, TS ≤ 109°C 250 BCR166W, TS ≤ 124°C 250 Tj Storage temperature T stg Thermal Resistance Parameter Junction - soldering point1) Symbol RthJS V mA mW BCR166, TS ≤ 102°C Junction temperature Unit 150 °C -65 ... 150 Value BCR166 ≤ 240 BCR166F ≤ 90 BCR166L3 ≤ 60 BCR166T ≤ 165 BCR166W ≤ 105 Unit K/W 1For calculation of R thJA please refer to Application Note Thermal Resistance 2 2006-05-03 BCR166... Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values min. typ. max. DC Characteristics Collector-emitter breakdown voltage V(BR)CEO 50 Unit V IC = 100 µA, IB = 0 Collector-base breakdown voltage 50 - - I CBO - - 100 nA I EBO - - 155 µA h FE 70 - - - - - 0.3 V Vi(off) 0.4 - 0.8 Vi(on) 0.5 - 1.4 Input resistor R1 3.2 4.7 6.2 Resistor ratio R1/R 2 0.09 0.1 0.11 fT - 160 - MHz Ccb - 3 - pF V(BR)CBO IC = 10 µA, IE = 0 Collector-base cutoff current VCB = 40 V, IE = 0 Emitter-base cutoff current VEB = 5 V, IC = 0 DC current gain1) IC = 5 mA, VCE = 5 V Collector-emitter saturation voltage1) VCEsat IC = 10 mA, IB = 0.5 mA Input off voltage IC = 100 µA, VCE = 5 V Input on voltage IC = 2 mA, VCE = 0.3 V kΩ - AC Characteristics Transition frequency IC = 10 mA, VCE = 5 V, f = 100 MHz Collector-base capacitance VCB = 10 V, f = 1 MHz 1Pulse test: t < 300µs; D < 2% 3 2006-05-03 BCR166... DC current gain hFE = ƒ(IC) VCE = 5 V (common emitter configuration) Collector-emitter saturation voltage VCEsat = ƒ(IC), hFE = 20 10 2 10 3 - 10 2 IC h FE mA 10 1 10 1 10 0 -1 10 10 0 10 1 mA 10 10 0 0 2 0.2 0.4 0.6 V IC 1 VCEsat Input on Voltage Vi(on) = ƒ(IC ) VCE = 0.3V (common emitter configuration) Input off voltage V i(off) = ƒ(IC) VCE = 5V (common emitter configuration) 10 1 10 2 mA mA 10 0 IC IC 10 1 10 -1 10 0 10 -2 10 -1 -1 10 10 0 10 1 V 10 10 -3 0 2 Vi(on) 0.2 0.4 0.6 V 1 Vi(off) 4 2006-05-03 BCR166... Total power dissipation Ptot = ƒ(TS) BCR166 Total power dissipation Ptot = ƒ(TS) BCR166F 300 300 mW 250 250 225 225 200 200 P tot P tot mW 175 175 150 150 125 125 100 100 75 75 50 50 25 25 0 0 15 30 45 60 75 90 105 120 °C 0 0 150 15 30 45 60 75 TS 150 TS Total power dissipation Ptot = ƒ(TS) BCR166L3 Total power dissipation Ptot = ƒ(TS) BCR166T 300 300 mW mW 250 250 225 225 200 200 Ptot Ptot 90 105 120 °C 175 175 150 150 125 125 100 100 75 75 50 50 25 25 0 0 15 30 45 60 75 90 105 120 °C 0 0 150 TS 15 30 45 60 75 90 105 120 °C 150 TS 5 2006-05-03 BCR166... Total power dissipation Ptot = ƒ(TS) BCR166W 300 mW 250 P tot 225 200 175 150 125 100 75 50 25 0 0 15 30 45 60 90 105 120 °C 75 150 TS Permissible Pulse Load RthJS = ƒ(tp ) BCR166 Permissible Pulse Load Ptotmax/P totDC = ƒ(tp) BCR166 10 3 10 3 Ptotmax / PtotDC K/W RthJS 10 2 - D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 2 10 1 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 10 0 10 -1 -6 10 10 -5 10 -4 10 -3 10 10 1 -2 s 10 10 0 -6 10 0 tp 10 -5 10 -4 10 -3 10 -2 s 10 0 tp 6 2006-05-03 BCR166... Permissible Puls Load RthJS = ƒ (tp) Permissible Pulse Load BCR166F Ptotmax/P totDC = ƒ(tp) BCR166F 10 2 10 3 D=0.5 0.2 0.1 0.05 0.02 0.01 0.005 0 10 1 10 0 10 -1 -6 10 P totmax/P totDC RthJS K/W 10 -5 10 -4 10 -3 10 2 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 1 10 -2 s 10 10 0 -6 10 0 10 -5 10 -4 10 -3 10 -2 s tp Permissible Pulse Load BCR166L3 Ptotmax/P totDC = ƒ(tp) BCR166L3 10 0 10 3 Ptotmax/ PtotDC RthJS 10 2 1 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 10 0 10 -1 -7 10 0 tp Permissible Puls Load RthJS = ƒ (tp) 10 10 10 -6 10 -5 10 -4 10 -3 10 -2 10 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 2 10 1 s 10 10 0 -7 10 0 tp 10 -6 10 -5 10 -4 10 -3 10 -2 s tp 7 2006-05-03 BCR166... Permissible Puls Load RthJS = ƒ (tp) Permissible Pulse Load BCR166T Ptotmax/P totDC = ƒ(tp) BCR166T 10 3 10 3 P totmax / P totDC K/W RthJS 10 2 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 2 10 1 D=0.5 0.2 0.1 0.05 0.02 0.01 0.005 0 10 0 10 -1 -6 10 10 -5 10 -4 10 -3 10 1 10 -2 s 10 10 0 -6 10 0 10 -5 10 -4 10 -3 10 -2 tp s 10 0 10 0 tp Permissible Puls Load RthJS = ƒ (tp) Permissible Pulse Load BCR166W Ptotmax/P totDC = ƒ(tp) BCR166W 10 3 10 3 Ptotmax / PtotDC K/W RthJS 10 2 - D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 2 10 1 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 10 0 10 -1 -6 10 10 -5 10 -4 10 -3 10 10 1 -2 s 10 10 0 -6 10 0 tp 10 -5 10 -4 10 -3 10 -2 s tp 8 2006-05-03 Package SC75 BCR166... Package Outline 1.6 ±0.2 0.2 +0.1 -0.05 A 0.1 MAX. 0.7 ±0.1 0.2 +0.1 -0.05 2 10˚ MAX. 0.8 ±0.1 1 10˚ MAX. 1.6 ±0.2 3 0.15 ±0.1 0.5 0.10 0.5 0.20 M M A Foot Print 0.65 1.15 0.65 0.4 0.4 0.5 0.5 Marking Layout (Example) 2005, December Date code BCR108T Type code Pin 1 Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 MAX. 1.8 8 1.4 0.45 Pin 1 1.75 0.9 9 2006-05-03 BCR166... Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 1) ) CES-Code Month 2 0 03 2 0 04 2005 2006 2 0 07 2008 2009 2010 2011 2012 2 0 13 2014 01 a p A P a p A P a p A P 02 b q B Q b q B Q b q B Q 03 c r C R c r C R c r C R 04 d s D S d s D S d s D S 05 e t E T e t E T e t E T 06 f u F U f u F U f u F U 07 g v G V g v G V g v G V 08 h x H X h x H X h x H X 09 j y J Y j y J Y j y J Y 10 k z K Z k z K Z k z K Z 11 l 2 L 4 l 2 L 4 l 2 L 4 12 n 3 N 5 n 3 N 5 n 3 N 5 1) New Marking Layout for SC75, implemented at October 2005. . 10 2006-05-03 Package SOT23 BCR166... 0.4 +0.1 -0.05 1) 2 0.08...0.1 C 0.95 1.3 ±0.1 1 2.4 ±0.15 3 0.1 MAX. 10˚ MAX. B 1 ±0.1 10˚ MAX. 2.9 ±0.1 0.15 MIN. Package Outline A 5 0...8˚ 1.9 0.2 0.25 M B C M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 1.3 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s 2005, June Date code (YM) Pin 1 BCW66 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 8 2.13 2.65 0.9 Pin 1 1.15 3.15 11 2006-05-03 Package SOT323 BCR166... Package Outline 0.9 ±0.1 2 ±0.2 0.3 +0.1 -0.05 0.1 MAX. 3x 0.1 M 0.1 A 1 2 1.25 ±0.1 0.1 MIN. 2.1 ±0.1 3 0.15 +0.1 -0.05 0.65 0.65 0.2 M A Foot Print 0.8 1.6 0.6 0.65 0.65 Marking Layout (Example) Manufacturer 2005, June Date code (YM) BCR108W Type code Pin 1 Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 0.2 2.3 8 4 Pin 1 2.15 1.1 12 2006-05-03 Package TSFP-3 BCR166... Package Outline 0.2 ±0.05 0.55 ±0.04 1 1.2 ±0.05 0.2 ±0.05 3 2 0.2 ±0.05 10˚ MAX. 0.8 ±0.05 1.2 ±0.05 0.15 ±0.05 0.4 ±0.05 0.4 ±0.05 Foot Print 1.05 0.45 0.4 0.4 0.4 Marking Layout (Example) Manufacturer BCR847BF Type code Pin 1 Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 1.2 1.5 8 0.3 Pin 1 0.7 1.35 13 2006-05-03 Package TSLP-3-4 BCR166... Package Outline Bottom view 0.4 +0.1 0.6 ±0.05 0.5 ±0.035 1) 2 3 2 1 0.35 ±0.05 Pin 1 marking 1±0.05 3 2 x 0.25 ±0.035 1) 0.575 ±0.05 0.05 MAX. 1 0.4 ±0.035 1) Top view 2 x 0.15 ±0.035 1) 1) Dimension applies to plated terminal Foot Print 0.225 0.225 Solder mask 0.315 R0.1 0.2 0.2 0.17 0.15 Copper 0.5 0.95 0.2 0.35 1 0.45 R0.19 0.255 0.6 0.38 For board assembly information please refer to Infineon website "Packages" Stencil apertures Marking Layout BCR133L3 Type code Pin 1 marking Laser marking Standard Packing Reel ø180 mm = 15.000 Pieces/Reel 0.5 Pin 1 marking 8 1.16 4 0.76 14 2006-05-03 BCR166... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2006. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 15 2006-05-03